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Technology Analysis and Strategic ManagementVolume 23, Issue 10, November 2011, Pages 1015-1030

The strength of R&D network ties in high-tech sectors - a multi-dimensional analysis of the effects of tie strength on innovation performance(Article)

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  • aResearch Centre for Education and the Labour Market, School of Business and Economics, Maastricht University, Netherlands
  • bDepartment of Organization and Strategy, UNU-MERIT, School of Business and Economics, Maastricht University, Netherlands
  • cNijmegen School of Management, Institute for Management Research, Radboud University Nijmegen, Netherlands

Abstract

We study the effect of the tie strength of inter-firm R&D partnerships on the innovation performance of companies in four high-tech sectors (pharmaceuticals, computers, semi-conductors and telecom). Returning to Granovetter's (1973) seminal contribution, tie strength is analysed through a broad multi-dimensional perspective. We find that inter-firm R&D network ties that are stronger in terms of their extent (measured by the length and multitude of R&D partnerships) and weaker in terms of their depth (the degree of cooperation and the similarity of ties of companies) improve the innovation performance of companies. Interestingly, we find strong support for the role of these R&D ties in the context of the run-of-the-mill innovation performance of companies. However, there is no support for this effect on significant innovations of companies. © 2011 Copyright Taylor and Francis Group, LLC.

Author keywords

high-tech sectorsinnovation performancenetwork tiesR&D partnershipstie strength

Indexed keywords

GEOBASE Subject Index:high technology industryinnovationnetworkingresearch and development
  • ISSN: 09537325
  • Source Type: Journal
  • Original language: English
  • DOI: 10.1080/09537325.2011.621294
  • Document Type: Article

  Bertrand-Cloodt, D.; Research Centre for Education and the Labour Market, School of Business and Economics, Maastricht University, Netherlands;
© Copyright 2012 Elsevier B.V., All rights reserved.

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