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Surface TechnologyVolume 22, Issue 2, June 1984, Pages 159-164

Fundamental aspects of pulsating current metal electrodeposition IX: The prevention of spongy deposit formation on inert substrates(Article)

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  • aFaculty of Technology and Metallurgy, University of Belgrade, Belgrade
  • bInstitute of Electrochemistry, Institute of Chemistry, Technology and Metallurgy, University of Belgrade, Belgrade

Abstract

It is shown that spongy deposits are obtained under d.c. conditions and that compact deposits are obtained in pulsating current (PC) deposition with high pause-to-pulse ratios at the same average current density and deposition time. This is explained by an increased nucleation rate in PC deposition. © 1984.

Indexed keywords

Engineering controlled terms:ZINC PLATING - Power Supply
Engineering main heading:ELECTRODEPOSITION
  • ISSN: 03764583
  • Source Type: Journal
  • Original language: English
  • DOI: 10.1016/0376-4583(84)90052-9
  • Document Type: Article

  Popov, K.I.; Faculty of Technology and Metallurgy, University of Belgrade,
© Copyright 2014 Elsevier B.V., All rights reserved.

Cited by 5 documents

Pandey, R.K. , Sahu, S.N. , Chandra, S.
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Silver powder electrodeposition by constant and pulsating overpotential
(1996) Journal of the Serbian Chemical Society
Phan, N.H. , Schwartz, M. , Nobe, K.
Pulsed electrodepositin of Fe-Ni-Co alloys
(1994) Electrochimica Acta
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