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High Temperature Materials and ProcessesVolume 31, Issue 1, February 2012, Pages 19-25

Characterization of alloys and liquidus projections of ternary Bi-Sb-Sn system(Article)(Open Access)

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  • aUniversity of Pristina, Faculty of Technical Sciences, Kosovska Mitrovica, Knjaza Milosa 7, 38220, Kosovska Mitrovica, Serbia
  • bUniversity of Kragujevac, Machinery Faculty, Kraljevo, Serbia
  • cUniversity of Belgrade, Technical Faculty, Bor, Serbia
  • dUniversity of Belgrade, Institute of Chemistry, Tehnology and Metallurgy, Belgrade, Serbia

Abstract

Given that Sn-based lead-free solders are considered as possible substitution for standard lead-tin solders, properties of the alloys from ternary Bi-Sb-Sn system were characterized by microstructural SEM-EDS analysis, Brinell hardness tests, and electrical conductivity measurements. Isothermal cross section at 298 K and liquidus surface projection were calculated by application of CALPHAD method and software package PANDAT 8.1. The experimentally determined phase compositions in analyzed microstructures were found to be in a good agreement with phases on calculated cross sections. Copyright © 2012 De Gruyter.

Author keywords

Bi-Sb-Sn ternary systemElectrical conductivityHardnessIsothermal sectionsMicrostructure

Indexed keywords

Engineering controlled terms:Application programsBrinell hardness testingElectric conductivityHardnessIsothermsMicrostructure
Engineering uncontrolled termsCALPHAD methodElectrical conductivityElectrical conductivity measurementsIsothermal sectionsLead-tin soldersLiquidus projectionLiquidus surface projectionMicro-structural
Engineering main heading:Lead-free solders

Funding details

Funding sponsor Funding number Acronym
Ministarstvo Prosvete, Nauke i Tehnološkog Razvoja172037,ON 172037MPNTR

  • 1

    The financial support of the Ministry of Education and Science of the Republic of Serbia under the Project ON 172037 is acknowledged. The results of this paper are also in the frame of the project COST MP0602. Calculations were performed using Pandat 8.1 software.

  • ISSN: 03346455
  • CODEN: HTMPE
  • Source Type: Journal
  • Original language: English
  • DOI: 10.1515/htmp.2011.124
  • Document Type: Article
  • Publisher: Walter de Gruyter GmbH and Co. KG

  Minić, D.; University of Pristina, Faculty of Technical Sciences, Kosovska Mitrovica, Knjaza Milosa 7, Serbia;
© Copyright 2020 Elsevier B.V., All rights reserved.

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