

Lead-free solders with copper are considered as a possible substitution for standard lead-tin solders. Ternary Bi-Cu-In system is a potential soldering material based on copper. For a more complete characterization of the ternary Bi-Cu-In system, alloys from the three vertical sections were investigated using microstructural analysis as well as by electrical conductivity and Brinell hardness measurements. The microstructures of the alloys were investigated at room temperature by application of scanning electron microscopy combined with energy dispersive spectrometry and optical microscopy. Isolines of electrical conductivity and hardness for the entire Bi-Cu-In system were calculated using regression models. In addition, a thermodynamic assessment of the system has been carried out by calculation of the isothermal section at 25 C and description of the liquidus surface using the CALPHAD method. Experimental and analytical results were found to be in a good agreement. © 2013 ASM International.
| Engineering uncontrolled terms | Bi-Cu-In systemBrinell-hardness measurementElectrical conductivityEnergy dispersive spectrometryIsothermal sectionsLiquidusMicrostructural analysisThermodynamic assessment |
|---|---|
| Engineering controlled terms: | CopperElectric conductivityHardnessMicrostructureRegression analysisScanning electron microscopy |
| Engineering main heading: | Alloys |
| Funding sponsor | Funding number | Acronym |
|---|---|---|
| Ministarstvo Prosvete, Nauke i Tehnološkog Razvoja | 172037,37020,TR37020,OI172037 | MPNTR |
This work was supported by the Ministry of Education and Science of the Republic of Serbia under Projects OI172037 and TR37020. Calculations were performed by Pandat 8.1 software.
Minić, D.; Faculty of Technical Science, University in Priština, Serbia;
© Copyright 2013 Elsevier B.V., All rights reserved.