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2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - ProceedingsSeptember 2019, Article number 8889610, Pages 133-13631st IEEE International Conference on Microelectronics, MIEL 2019; Nis; Serbia; 16 September 2019 through 18 September 2019; Category numberCFP19432-ART; Code 153916

Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters(Conference Paper)(Open Access)

  • Mladenovic, I.,
  • Lamovec, J.,
  • Jovic, V.,
  • Obradov, M.,
  • Radulovic, K.,
  • Vasiljevi Radovi, D.,
  • Radojevic, V.
  Save all to author list
  • aScientific Institution Institute of Chemistry, University of Belgrade, Department of Microelectronic Technologies, Njegoševa 12, Beograd, 11000, Serbia
  • bDepartment of Materials Engineering, Faculty of Technology and Metallurgy UB, Serbia

Abstract

Copper coatings are produced on silicon wafer by electrodeposition (ED) for various cathode current densities. The resulting composite systems consist of 10 μm monolayered copper films electrodeposited from sulphate bath on Si wafers with sputtered layers of Cr/Au. Hardness measurements were performed to evaluate properties of the composites. The composite hardness (Hc) was characterized using Vickers microindentation test. Then, an artificial neural network (ANN) model was used to study the relationship between the parameters of metallic composite and their hardness. Two experimental values: Applied load during indentation test and current density during the ED process were used as the inputs to the neural network. Finally, the results of the composite hardness (experimental and predicted) were used to estimate the film hardness (Hf) of copper for each variations of the current density. This article shows that ANN is an useful tool in modeling composite hardness change with variation of experimental parameters predicting hardness change of composite Si/Cu with average error of 6 %. Using created ANN model it is possible to predict microhardness of Cu film for current density or indentation load for which we do not have experimental data. © 2019 IEEE.

Indexed keywords

Engineering controlled terms:Composite filmsCopper compoundsCurrent densityElectrodepositionElectrodesHardnessMetallic filmsMetalsMicroelectronicsNeural networksSilicon wafersSulfur compounds
Engineering uncontrolled termsArtificial neural network modelsCathode current densityComposite hardness modelsExperimental parametersExperimental valuesHardness measurementMetallic compositesVickers microindentation
Engineering main heading:Indentation

Funding details

Funding sponsor Funding number Acronym
Ministarstvo Prosvete, Nauke i Tehnološkog Razvoja32008,TR 34011,TR 32008MPNTR
  • 1

    This work was funded by Ministry of Education, science and Technological Development of Republic of Serbia through the orijects TR 32008 and TR 34011.

  • ISBN: 978-172813419-2
  • Source Type: Conference Proceeding
  • Original language: English
  • DOI: 10.1109/MIEL.2019.8889610
  • Document Type: Conference Paper
  • Sponsors: IEEE Electron Devices Society (EDS)
  • Publisher: Institute of Electrical and Electronics Engineers Inc.


© Copyright 2020 Elsevier B.V., All rights reserved.

Cited by 1 document

Gowrishankar, M.C. , Doddapaneni, S. , Sharma, S.
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(2023) Materials Research Express
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