

As textile electronics has undergone a boom in the past few decades, especially the sensing aspect, methods of modular connectivity of these components with classical electrical components and printed circuit boards must be broadened. This study focuses on the aforementioned problem, as well as testing the electrical properties of conductive textile lines through a series of experiments. Fabrication of the conductive structure was done in two parts: embroidery of the conductive threads onto cloths, as well as designing and three-dimensional printing of connectors that will be used for bridging and making a stable connection with pin-based systems. A valid connection between the textile endings and pins has not yet been tested, and is the main focus of this paper, aside from testing outside influences on the designed textile structure. Afterwards, the developed prototype was tested through a realistic scenario that consisted of body temperature validations and the application of artificial sweat, as well as the quantification of the effects of washing on the electrical properties of the device. The outcome shows changes in the impedance modulus after washing. However, after application of artificial sweat, the nature of the parallel wire connections changes significantly, as the sweat acts as a resistive contact between the two wires. This examination can contribute to the field of wearable electronics through the proposed elements (conductive lines and connectors) of future electronic circuits in the concept of internet of bodies. © The Author(s) 2022.
| Engineering controlled terms: | 3D printersSmart textilesSoftware prototypingWashingWeavingWell testing |
|---|---|
| Engineering uncontrolled terms | Conductive linesConductive textilesConductive threadsConnectorElectrical componentsElectrical performanceExternal influencesModularsThree-dimensional-printingWeaving |
| Engineering main heading: | Fabrication |
| PaperChem Variable: | ApplicationComponentsConstructionElectrical PropertiesTestingTextilesWashingWeaving |
| Funding sponsor | Funding number | Acronym |
|---|---|---|
| Horizon 2020 Framework Programme See opportunities by H2020 | 854194 | H2020 |
The author(s) disclosed receipt of the following financial support for the research, authorship and/or publication of this article: This work was supported by the European Union’s Horizon 2020 Research and Innovation Programme (grant agreement no. 854194).
Milić, L.; Faculty of Technical Sciences, University of Novi Sad, Trg Dositeja Obradovica, Novi Sad, Serbia;
© Copyright 2023 Elsevier B.V., All rights reserved.