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IEEE Sensors JournalVolume 23, Issue 18, 15 September 2023, Pages 21010-21017

Thermally Coupled Thick-Film Thermistors: Main Properties and Applications(Article)

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  • Faculty of Technical Sciences, University of Novi Sad, Novi Sad, 21000, Serbia

Abstract

A pair of thick-film segmented thermistors with negative temperature coefficient (NTC) were joined together (back-to-back) to form thermally coupled device. The alumina substrate enables very high galvanic insulation of thermistors and thermal coupling at the same time. The input thermistor R1 in the coupled pair was self-heated at constant voltages and the output thermistor R2 was a heat receiver through the alumina substrate. Custom-designed NTC thick-film thermistor pastes were made out of nickel manganese and modified nickel manganese. Thermistor electrical resistances were measured in a climatic test chamber and the thermistor exponential temperature factor B was determined for both pastes. The TCT device was electrically characterized at different ambient temperatures. The input power, heat transfer, resistance, and temperature of both thermistors were measured as a function of input voltage and time. The input and output thermistor temperatures T1 and T2 were obtained using the thermistor resistance and the Steinhart-Hart equation. The device sensitivity and measuring inaccuracy were analyzed. The main advantage of TCT is thermal coupling/electrical decoupling. The applications of TCT device are seen in automotive electronics, home appliances, and power converters to measure output temperature versus input power. © 2023 IEEE.

Author keywords

Temperature sensorsthick-film thermistors

Indexed keywords

Engineering controlled terms:AluminaAluminum oxideDomestic appliancesHeat resistanceHeat transferNickelSubstratesTemperatureTemperature measurementThermal insulationThermistorsThick films
Engineering uncontrolled termsAlumina substratesConstant voltageCoupled devicesElectrical resistance measurementGalvanic insulationInput powerNegative-temperature-coefficientsPropertyThermal couplingThick film thermistor
Engineering main heading:Temperature sensors

Funding details

Funding sponsor Funding number Acronym
451-03-47/2023-01/200156
  • 1

    This work was supported by the Ministry of Science, Technological Development and Innovation through "Innovative Scientific and Artistic Research" from the FTS (activity) Domain under Project 451-03-47/2023-01/200156.

  • ISSN: 1530437X
  • Source Type: Journal
  • Original language: English
  • DOI: 10.1109/JSEN.2023.3298224
  • Document Type: Article
  • Publisher: Institute of Electrical and Electronics Engineers Inc.

  Bodic, M.Z.; Faculty of Technical Sciences, University of Novi Sad, Novi Sad, Serbia;
© Copyright 2023 Elsevier B.V., All rights reserved.

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