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IEEE Sensors JournalVolume 24, Issue 8, 15 April 2024, Pages 12058-12065

Thermally Coupled NTC Disk Thermistors for Power Applications(Article)

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  • University of Novi Sad, Faculty of Technical Sciences, Novi Sad, 21000, Serbia

Abstract

A pair of small disk negative thermal coefficient (NTC) thermistors were joined together laterally using a thin layer of silicon resin between them to form a novel thermally coupled device (TCT). The epoxy coating on disk thermistors enables concurrent galvanic isolation and thermal coupling. Input thermistor Th1 in the coupled pair was self-heated at constant voltages and acts as heat transmitter while the output thermistor Th2 acted as a heat receiver through the epoxy layer and silicon resin. Small NTC disk thermistors with different nominal resistances were produced out of nickel manganese and modified nickel manganese powder. The disk thermistor resistances and the thermistor exponential temperature factor B were measured in the climatic test chamber. The input power, resistance, and temperature of both disk thermistors were measured at different ambient temperatures as a function of input voltage and time. The temperature of thermistors Th1 and Th2 (input and output) was determined using the Steinhart-Hart equation. The TCT device sensitivity, stability, and inaccuracy were also analyzed. The applications of disk TCT devices are based on the measuring of output temperature versus input power in automotive electronics, home appliances, and power convertors. © 2001-2012 IEEE.

Author keywords

Disk thermistorstemperature sensors

Indexed keywords

Engineering controlled terms:Domestic appliancesEpoxy resinsManganeseResins
Engineering uncontrolled termsCoupled devicesDisk thermistorsEpoxy coatingsGalvanic isolationInput powerNTC thermistorsPower applicationsSilicon resinsThermal couplingThin layers
Engineering main heading:Thermistors
  • ISSN: 1530437X
  • Source Type: Journal
  • Original language: English
  • DOI: 10.1109/JSEN.2024.3371181
  • Document Type: Article
  • Publisher: Institute of Electrical and Electronics Engineers Inc.

  Bodic, M.Z.; University of Novi Sad, Faculty of Technical Sciences, Novi Sad, Serbia;
© Copyright 2024 Elsevier B.V., All rights reserved.

Cited by 1 document

Bodić, M.Z. , Aleksić, S.O. , Rajs, V.M.
Thermally Coupled NTC Chip Thermistors: Their Properties and Applications
(2024) Sensors
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{"topic":{"name":"Sintering; Thin Films; Manganese","id":17055,"uri":"Topic/17055","prominencePercentile":83.48313,"prominencePercentileString":"83.483","overallScholarlyOutput":0},"dig":"42761544b36a4909c1717de4bbf9151f90ca8beb6d8c6bffc0cc912d8534bef6"}

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